14 Gbps Aggregated Data Throughput at only 30 mW
Silicon Line GmbH introduces a new multi-channel PHY-chipset for optical data transmission
SL82716 726vsSilicon Line GmbH, a provider of ultra-low power analog ICs, today announced the release of a new 4x 3.5 Gigabit per second (Gbps) transimpedance amplifier (TIA) with integrated limiting amplifier (LA) and a new 4x 3.5 Gigabit per second (Gbps) Vertical Cavity Surface Emitting Laser (VCSEL) driver. The complete chipset is capable of transporting up to 14 Gbps aggregated data thereby consuming a total power of less than 30 mW, only.
The 4-channel VCSEL driver (SL82726) is based on Silicon Line's successful ultra-low power single-channel series. With only 4.5 mW for all 4 channels operated simultaneously, it is possible to use the SL82726 in a single-package VCSEL/VCSEL-driver hybrid design without heating up the temperature sensitive lasers. The ultra-low power receiver IC (SL82716) dissipates less than 25 mW at maximum aggregated data throughput.
Both ICs are designed in standard CMOS and feature an SLVS-interface at their electrical I/Os. Aside from being connected to other SLVS-compliant ICs, the chips can also be connected to any LVDS-compliant I/O, directly. With less than 1 mm² die area the chips may easily be integrated into a TOSA or ROSA.
"It is interesting to note how fast the world gains momentum on short-range optical links as real alternative to shielded twisted pairs or micro-coaxial cables", said Holger Hoeltke, Managing Director at Silicon Line. "Especially for applications requiring high-speed links over mechanically stressed and crowded hinges, or in ESD- or EMI-sensitive environments, optical links based on polymer optical waveguides offer some fascinating advantages. One of the most important prerequisites to adapt optical links in battery operated devices is a very low power dissipation, however. Silicon Line is proud to have addressed this challenge and to provide an enabling technology into this fast growing market", Hoeltke added.